Исследование степени деформации многослойных пакетов при ударном нагружении полусферическим ударником с применением CAE систем

Abstract

With the increase in number of thin parts, engineering problem need to improve their shock resistance, while reducing material consumption. The solution to this prob-lem, we see use of multilayer structures. The tasks of numerical modeling of deformation of plates and packages consisting of titanium, aluminum ceramic plates of different thicknesses. Simulated wafer subjected to impact shock hemispherical drummer, in a package using ANSYS finite element method.