Определение температурных напряжений платы с размещенными на ней электронными радиотехническими элементами

Abstract

In this article the temperature stresses for plate with radio-electronic elements are determined. For this purpose the problems of heat conduction and thermoelasticity are solved. Temperature stresses are found by ANSYS complex for rectangular plates. The results are required to make choice of cooling system. These plates with radio-electronic elements and water cooling system are used in the airborne equipment of native airplanes.