3D моделирование вибрационного алмазного шлифования

Abstract

By finite element simulation of ultrasonic grinding found that when grinding without imposing high frequency oscillations of the maximum load is concentrated on certain faces of diamond grains. This can be the destruction of grain in the contact zone with a bunch and its subsequent premature dropout from it. In the case of imposition of high-frequency oscillations of voltage are evenly distributed along the grain, that improves its hold together.